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Fully automatic terminal-equipped (dipping) device
· Applications for small chip products such as MLCCs, chip inductors, and chip resistors · Full automation (including dipping, drying furnace, and discharge) · Capable of handling various shapes with equipment modifications · Achieves high productivity, accuracy, and yield · User-friendly touch panel and PC operation for operators
Achieve high product quality with a high-precision positioning mechanism! Compatible with various types of workpieces.
The "TM-9822" is a machine that applies ground electrodes to ceramic elements with high precision. Thanks to its high-precision positioning mechanism, it enhances the quality of the products, and it can accommodate various types of workpieces through jig exchange. 【Features】 ■ High-precision positioning mechanism ■ Ability to enhance product quality ■ Capable of handling various workpieces through jig exchange *For more details, please refer to the PDF document or feel free to contact us.
Ideal for external electrode coating of capacitors, inductors, varistors, and thermistors! Mass production possible in 0201 mm! Equipped with unique helical blot technology!
We have newly adopted a variety of blot processes to improve the application shape. It is possible to achieve uniform film thickness (corner film thickness) for reliability enhancement in automotive, large-capacity AI servers, and smartphones. - Precise control of operations at the micron (μm) level. - Realization of diverse recipes through five types of blotting operation patterns (vertical, horizontal, inclined, arc, helical). - Various process support such as setting application conditions. - Production of application samples. [NEW] A new high-precision specification that enables even more precise application control has also been introduced. - A safety specification that promises greater safety for operators. - The behavior of electrode formation can be confirmed using an observation camera. - There is a function for measuring electrode width using a high-precision camera. *For more details, please feel free to contact us.
Achieving mass production of diverse ultra-small array chips.
Fully automatic array coating device focusing on coating accuracy and line quality. Fully automated carrier transport significantly increases production capacity. Array coating device emphasizing coating accuracy and line quality - Improved coating line quality and durability with a uniquely developed transfer mask - Achieves high-precision coating with a high-precision alignment mechanism - Easy setup for item changes - Supports array coating for sizes from 0603 to 3216 mm High-precision coating for small sizes is possible with our in-house developed mask! - Increased durability of the mask using uniquely developed materials - Improved release properties through special treatment of the mask, achieving the ideal electrode shape - High straightness in line coating made possible through precision processing
